Method of semiconductor substrate batch demounting

Abstract

This is a method of cassette-to-cassette batch demounting process that includes providing an apparatus having two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates. The thinned semiconductor substrate will gradually demount from its support substrate by gravitational force and vertically slides down into the bottom cassette.

Dependencies are inferred from the claim text.