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US 6,601,313 B2Granted
System and method for detecting position of semiconductor wafer
AssigneeSamsung Electronics Co., Ltd.
InventorsWun-Myong Shin, Sun-Kyu Kim
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AssigneeSamsung Electronics Co., Ltd.
InventorsWun-Myong Shin, Sun-Kyu Kim
Estimating the term…
To prevent process defects and wafer damage caused by improperly positioned wafers, a system and method for detecting a position of a wafer determines whether the wafer is properly positioned before executing a process. The system includes a chuck plate preferably having a supporting part configured to support a lower face of the wafer and a guide part located on a perimeter of the supporting part. A sensing unit senses a positional state of the wafer on an upper portion of the supporting part. A controller receives a signal corresponding to the positional state of the wafer from the sensing unit, and determines whether the wafer is properly positioned. The controller then sends an output control signal to an outputting unit to notify an operator of the wafer position. In this manner, process defects are avoided and a fabricating yield and operating rate of a fabrication unit increases.
A system that positions a semiconductor wafer, said system comprising:
A method for properly positioning a semiconductor wafer on a chuck plate in a fabrication unit, said method comprising:
A system that positions a semiconductor wafer, said system comprising:
A system for positioning a semiconductor wafer, said system comprising:
Dependencies are inferred from the claim text.