Back to results
US 6,600,201 B2Granted
Systems with high density packing of micromachines
AssigneeHewlett-Packard Development Company, L.P.
InventorsPeter G. Hartwell, Robert G. Walmsley
Life of this patent
Estimating the term…
Abstract
Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.
Claims13
A micromachine system comprising:
- a substrate defining a trench;
- a first microelectromechanical device arranged at least partially within said trench, said first microelectromechanical device including a first portion, said first portion being configured to move relative to said substrate;
- and
- a second microelectromechanical device arranged at least partially within said trench and adjacent to said first microelectromechanical device, said second microelectromechanical device including a first portion, said first portion being configured to move relative to said substrate.
1 more element
Dependencies are inferred from the claim text.