Method of fabricating jig for vacuum apparatus
AssigneeSeiko Epson Corporation
InventorMasao Shibasaki
Life of this patent
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Abstract
A base member is blasted to roughen the surface. Next, a thermal spray member containing for example Al is formed on the blast treated surface of the base member by a thermal spraying. Next, an extremely thin oxide film at an atom layer level is coated on the surface of the thermal spray member, as an uppermost surface. The oxide film is a layer that is formed from stacked layers of about 15 to 23 atoms, and is formed by an O2 or O3 gas plasma, an atmospheric pressure plasma, or a CVD (chemical vapor deposition) method. A nitride film can be coated instead of the oxide film.
Claims5
A method of fabricating a jig for a vacuum apparatus, which is provided in a vacuum chamber for forming a film on a wafer located on a wafer stage, said wafer stage being separate from the jig, to prevent deposits from adhering to the vacuum chamber, the method comprising:
- blasting on a base member to roughen the surface,
- thermally spraying a thermal spray layer on the base member, and
- covering a surface of the thermal spray layer with an oxide film or a nitride film as an uppermost surface.
A method of fabricating a jig for a vacuum apparatus, which is provided in a vacuum chamber for forming a film on a wafer located on a wafer stage, said wafer stage being separate from the jig, to prevent deposits from adhering to the vacuum chamber, the method comprising:
- blasting a base member to roughen the surface,
- coating the base member with an intermediate layer,
- thermally spraying a thermal spray layer on the intermediate layer, and
- covering a surface of the thermal spray layer with an oxide film or nitride film as an uppermost surface,
- wherein the intermediate layer adsorbs a discharging gas component contained in the thermal spray layer.
Dependencies are inferred from the claim text.