Wrought processing of brittle target alloy for sputtering applications
AssigneeHeraeus, Inc.
InventorsMichael Bartholomeusz, Michael Tsai, Anand Deodutt
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Abstract
An ingot of material which is normally too brittle to allow successful rolling and wrought processing is formed so as to have a thickness-to-width ratio of less than about 0.5 and is annealed in a temperature range of 1000° F. to 2500° F. for a preselected time. The ingot is then rolled in a temperature range of 1500° F. to 2500° F. Additional/optional annealing of the resulting rolled plate in a temperature range of 500° F. to 2000° F., or between room temperature and 1500° F., and/or a final annealing between 500° F. and 1500° F., is possible. Sputtering targets are cut out of the rolled plate and used for the manufacture of storage disks.
Claims17
A magnetron sputtering target having a homogeneous, dense microstructure and low permeability having a homogeneous distribution of a precipitate phase, said target being prepared by forming a brittle cobalt-base alloy into an ingot having a thickness-to-width aspect ratio of less than 0.5, annealing the ingot at a temperature between 1500° F. and 2500° F. to promote recrystallization of the microstructure for relaxation of internal strain and to prevent cracking of the ingot during hot rolling, and hot rolling the ingot to form said target having said homogeneous, dense microstructure.
Dependencies are inferred from the claim text.