Substrate processing unit and processing method
AssigneeTokyo Electron Limited
InventorsTakahiro Kitano, Shinji Kobayashi, Yukihiko Esaki, Masateru Morikawa
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Abstract
The present invention includes a current plate which is arranged above a substrate in a chamber. A pressure inside the chamber is reduced by exhaust means and drying processing is performed on, for example, a coating solution on the substrate. On a peripheral portion of an underneath surface of the current plate, formed is a ring-shaped protrusion corresponding to a peripheral portion of the substrate. A protruding portion of a coating solution at the peripheral portion of the substrate is made flat by air current generated when the pressure is reduced, and consequently a coating film with a uniform film thickness as a whole is formed on the substrate.
Claims12
A substrate processing unit for performing predetermined processing on a substrate in a processing section after applying a coating solution to the substrate comprising:
- exhaust means for reducing a pressure inside said unit;
- a current plate for rectifying air current generated in the processing section due to exhaust by said exhaust means, which is arranged above the substrate,
- an underneath surface of said current plate having a protrusion which protrudes downward compared with other portions thereof corresponding to an outer peripheral portion of the substrate and the protrusion is disposed right above the outer peripheral portion of the substrate.
A substrate processing unit for performing predetermined processing on a substrate in a processing section after applying a coating solution to the substrate comprising:
- exhaust means for reducing a pressure inside said unit;
- a current plate for rectifying air current generated in the processing section due to exhaust by said exhaust means, which is arranged above the substrate,
- an underneath surface of said current plate having a protrusion which protrudes downward compared with other portions thereof corresponding to an outer peripheral portion of the substrate, and the protrusion is disposed right above the outer peripheral portion of the substrate, and
- a heating device for heating a peripheral portion of said current plate.
A substrate processing unit for performing predetermined processing on a substrate in a processing section after applying a coating solution to the substrate comprising:
- exhaust means for reducing a pressure inside said unit;
- and
- a current plate for rectifying air current generated in the processing section due to exhaust by said exhaust means, which is arranged above the substrate,
- an underneath surface of said current plate having a protrusion which protrudes downward compared with other portions thereof corresponding to an outer peripheral portion of the substrate, and the protrusion is disposed right above the outer peripheral portion of the substrate, and
- a peripheral portion of an underneath surface of said current plate having a color which is lower in lightness than that of other portions thereof.
Dependencies are inferred from the claim text.