Method of drying wafers

A wafer drying method, comprising the steps of:

• providing a microwave-drying chamber, said microwave drying chamber comprising:
• (i) a first and a second entry port, liquid cleaning fluid being entered into the microwave drying chamber through said first entry port, an inert gas being entered into the microwave drying chamber though said second entry port;
• (ii) a top cover;
• (iii) a drain and an exhaust vent;
• (iv) a wafer arrestor positioned inside said microwave drying chamber for proper positioning of wafers inside said microwave drying chamber;
• (v) at least one ultrasonic nebulizer, positioned inside said microwave drying chamber;
• (vi) the ability to supply cleaning fluid to said at least one ultrasonic nebulizers via said first entry port to said microwave drying chamber;
• and
• (vii) the ability of creating first and second microwave energy inside said microwave-drying chamber by using a microwave energy supply unit;
• positioning at least one wafer inside said microwave drying chamber;
• performing a first processing step, said first processing step creating a cleaning vapor, inside a microwave drying chamber, said cleaning vapor being generated by an ultrasonic nebulizer;
• performing a second processing step by applying microwave energy to the wafer and to the cleaning vapor, heating the cleaning vapor, removing the cleaning vapor from the surface of said at least one wafer.

A wafer drying method, comprising the steps of:

• providing a microwave-drying chamber, said microwave drying chamber comprising:
• (i) a first and a second entry port, IPA possibly mixed with DIA being entered into the microwave drying chamber through said first entry port, an inert gas being entered into the microwave drying chamber though said second entry port;
• (ii) a top cover;
• (iii) a drain and an exhaust vent;
• (iv) a wafer arrestor positioned inside said microwave drying chamber for proper positioning of wafers inside said microwave drying chamber;
• (v) at least one ultrasonic nebulizer, positioned inside said microwave drying chamber;
• (vi) the ability to supply isopropyl alcohol (IPA), possibly mixed with DI water, to said at least one ultrasonic nebulizers via said first entry port to said microwave drying chamber;
• and
• (vii) the ability of creating first and second ultrasonic energy inside said microwave-drying chamber by using a microwave energy supply unit;
• positioning at least one wafer inside said microwave drying chamber;
• performing a first processing step, said first processing step creating an IPA vapor, possibly mixed with DIW, inside a microwave drying chamber, said IPA vapor, possibly mixed with DIW being generated by an ultrasonic nebulizer;
• performing a second processing step by applying microwave energy to the wafer and to the IPA vapor, possibly mixed with DIW, heating the IPA vapor, possibly mixed with DIW, removing the IPA vapor, possibly mixed with DIW, from the surface of said at least one wafer.

A wafer drying method, comprising the steps of:

• providing a microwave drying chamber, said microwave drying chamber having been provided with a first and a second entry port, isopropyl alcohol (IPA) possibly mixed with DI water (DIW) being entered into the microwave drying chamber through said first entry port, an inert gas being entered into the microwave drying chamber though said second entry port, said microwave drying chamber further having been provided with a top cover, said microwave drying chamber further having been provided with a drain and an exhaust vent, a wafer arrestor having been positioned inside said microwave drying chamber for proper positioning of wafers inside said microwave drying chamber, at least one ultrasonic nebulizer having been positioned inside said microwave drying chamber, isopropyl alcohol (IPA), possibly mixed with DI water, being supplied to said at least one ultrasonic nebulizers via said first entry port to said microwave drying chamber, said microwave drying chamber being able of creating ultrasonic energy inside said microwave drying chamber by using a microwave energy supply unit;
• providing at least one wafer;
• removing the top cover from said microwave drying chamber;
• positioning said at least one wafer inside said microwave drying chamber, using said wafer arrestor for proper positioning of said at least one wafer;
• placing said top cover on the microwave-drying chamber;
• opening said first entry port to the microwave drying chamber, thereby applying isopropyl alcohol (IPA), possibly mixed with DI water, to said at least one ultrasonic nebulizer;
• allowing conversion of the supplied IPA, possibly mixed with DIW, into a spray of IPA vapor, possibly mixed with DI water vapor, by the microwave drying chamber for energizing a microwave energy that is present inside the microwave drying chamber by energizing the microwave energy supply unit for a period of time of at least 30 seconds;
• discontinuing the supply of IPA, possibly mixed with DI water, by closing the first entry port to the microwave-drying chamber;
• activating the microwave energy supply unit of the microwave-drying chamber, generating microwave energy inside the microwave drying chamber;
• opening the exhaust vent and the second port of entry of the microwave drying chamber, allowing inert gas to enter into the microwave drying chamber, thereby removing IPA vapors, possibly mixed with DIW vapors, from the microwave drying chamber;
• drying the IPA, possibly mixed with DIW, on the surface of said wafer;
• and
• turning off the microwave unit of the microwave-drying chamber.