Use of endpoint system to match individual processing stations within a tool
AssigneeAdvanced Micro Devices, Inc.
InventorsAlexander J. Pasadyn, Joyce S. Oey Hewett
Life of this patent
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Abstract
A technique for processing a wafer in a semiconductor manufacturing process are disclosed. The method comprises first collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool. The collected processing rate data is then communicated to a controller that autonomously compares the processing rate data to determine whether to adjust a process parameter. The method then adjusts the process parameter for at least one station to match the process endpoint for the at least one station.
Claims38
A method for processing a wafer in a semiconductor manufacturing process, comprising:
- collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool;
- communicating the collected processing rate data to a controller;
- autonomously comparing the processing rate data to determine whether to adjust a process parameter;
- and
- adjusting the process parameter for at least one station to match the process endpoint for the at least one station.
A program storage medium encoded with instructions that, when executed by a computing device, perform a method for processing a wafer in a semiconductor manufacturing process, comprising:
- collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool;
- communicating the collected processing rate data to a controller;
- autonomously comparing the processing rate data to determine whether to adjust a process parameter;
- and
- adjusting the process parameter for at least one station to match the process endpoint for the at least one station.
A computing device programmed to perform a method for processing a wafer in a semiconductor manufacturing process, comprising:
- collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool;
- communicating the collected processing rate data to a controller;
- autonomously comparing the processing rate data to determine whether to adjust a process parameter;
- and
- adjusting the process parameter for at least one station to match the process endpoint for the at least one station.
Dependencies are inferred from the claim text.