Mounting system for high-voltage semiconductor device

A mounting system for mounting a semiconductor device to a heat sink, wherein the semiconductor device is a semiconductor package comprising a semiconductor die, a heat spreader disposed adjacent the semiconductor die, a body of non-conductive material disposed around the semiconductor die, and a plurality of leads, and wherein the heat sink comprises a sheet of thermally conductive material, the mounting system comprising:

• a rigid retainer, comprising a block of non-conductive material having a central recess and a fastener recess therein, the central recess open to at least two adjacent faces of the block of non-conductive material and configured to expose at least a portion of the heat spreader when the semiconductor package is disposed in the central recess with the plurality of leads extending from the retainer, and the fastener recess shaped to cooperate with a fastener, the fastener recess positioned within the retainer so that the fastener can pass through the retainer and be spaced from a periphery of the semiconductor package when the semiconductor package is disposed in the central recess;
• and
• a pressure clamp configured for disposing against an exterior of the retainer opposite to the body and attaching to the heat sink, for compressing the package against the sink.