Water-cooled system and method for cooling electronic components
AssigneeSun Microsystems, Inc.
InventorsShlomo Novotny, Arthur S. Rousmaniere, Marlin Vogel
Life of this patent
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Abstract
A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic circuit is coupled to the surface for removing heat from the integrated circuit. The closed-loop fluidic circuit includes a heat exchanger. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger.
Claims42
A system for cooling electronic components, the system comprising:
- a surface;
- one or more electronic components coupled to the surface, the one or more electronic components including an integrated circuit;
- a closed-loop fluidic circuit coupled to the surface for removing heat from the integrated circuit, the closed-loop fluidic circuit including a heat exchanger and a cold plate that is in thermal contact with the integrated circuit, such that fluid heated within the cold plate is received by and flows through the heat exchanger;
- and
- a blower coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis, the blower arranged beside the heat exchanger to provide at least one air path between the second port of the blower and the heat exchanger that is parallel to the plane of the surface, wherein the blower moves air across the heat exchanger and also across at least one of the one or more electronic components.
A system for cooling electronic components, the system comprising:
- a surface;
- one or more electronic components coupled to the surface, the one or more electronic components including an integrated circuit;
- a closed-loop fluidic circuit coupled to the surface for removing heat from the integrated circuit, the closed-looped fluid circuit including a heat exchanger and a cold plate that is in thermal contact with the integrated circuit, such that fluid heated within the cold plate is received by and flows through the heat exchanger;
- and
- a blower coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis, the blower oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger, wherein the blower moves air across the heat exchanger and also across at least one of the one or more electronic components.
A system for cooling electronic components, the system comprising:
- a first surface;
- one or more electronic components coupled to the first surface, the one or more electronic components including an integrated circuit;
- and
- a module attached to a second surface, the module including:
- a closed-loop fluidic circuit for removing heat from the integrated circuit, the closed-loop fluidic circuit including a heat exchanger and a cold plate that is in thermal contact with the integrated circuit, such that fluid heated within the cold plate is received by and flows through the heat exchanger;
- and
- a blower for moving air across the heat exchanger and also across at least one of the one or more electronic components.
A system for cooling electronic components, the system comprising:
- a first surface;
- one or more electronic components coupled to the first surface, the one or more electronic components including an integrated circuit;
- and
- a module coupled to and positioned beside the first surface, the module including:
- a closed-loop fluidic circuit for removing heat from the integrated circuit, the closed-loop fluidic circuit including a heat exchanger and a cold plate that is in thermal contact with the integrated circuit, such that fluid heated within the cold plate is received by and flows through the heat exchanger;
- and
- a blower for moving air across the heat exchanger and also across at least one of the one or more electronic components.
Dependencies are inferred from the claim text.