Vacuum package fabrication of integrated circuit components
AssigneeRaytheon Company
InventorsRoland W. Gooch, Thomas R. Schimert
Life of this patent
Estimating the term…
Abstract
A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated area on a substrate, material and surrounds one or more integrated circuit devices. The vacuum package also includes a sealing layer on the sealing ring. A vacuum package lid is sealed to the sealing ring by the sealing layer on the sealing ring. The vacuum package lid provides a vacuum cell for the one or more integrated circuit devices.
Claims15
A vacuum package containing one or more integrated circuit devices, comprising:
- one or more integrated circuit devices formed on a device wafer, said devices having one or more associated bonding pads;
- a sealing ring formed on the device wafer between the perimeter of the one or more integrated circuit devices and the one or more bonding pads coupled to the one or more integrated circuit devices;
- a plurality of uniform thickness control spacers formed as part of and distributed around the sealing ring;
- and
- a vacuum package lid sealed to the sealing ring, the vacuum package lid uniformly spaced from the device wafer by the control spacers thereby providing a vacuum cell for the one or more integrated circuit devices.
A vacuum package for integrated circuit devices, comprising:
- a sealing ring having a plurality of uniform thickness control spacers distributed around the sealing ring, the sealing ring in a designated area on a substrate material, the sealing ring surrounding one or more integrated circuit devices;
- a sealing layer on the sealing ring;
- and
- a vacuum package lid sealed to the sealing ring by the sealing layer on the sealing ring, the vacuum package lid providing a vacuum cell for the one or more integrated circuit devices.
A vacuum package containing a plurality of integrated circuit devices, comprising:
- a plurality of integrated circuit devices formed in a pattern on a device wafer, said circuit devices each having one or more associated bonding pads;
- a plurality of sealing rings formed on the device wafer, each sealing ring surrounding one or more of the plurality of integrated circuit devices between the perimeter of the one or more integrated circuit devices and one or more bonding pads coupled to the surrounding one or more integrated circuit devices;
- a plurality of uniform thickness control spacers formed as part of and distributed around each of the plurality of sealing rings;
- and
- a vacuum package lid for providing a plurality of vacuum cells, a vacuum cell for each of the one or more integrated circuit devices surrounded by one of the plurality of sealing rings, the vacuum package lid uniformly spaced from the device wafer by the control spacers and sealing to the plurality of sealing rings.
Dependencies are inferred from the claim text.