Variable rotational assignment of interconnect levels in integrated circuit fabrication
AssigneeLucent Technologies Inc.
InventorsThaddeus John Gabara, Tarek Chaker Jomaa
Life of this patent
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Abstract
Integrated circuit fabrication techniques are provided which allow non-horizontal/non-vertical wires to traverse the entire chip surface, rather than just the corners as in the conventional Manhattan geometry, while interconnecting circuit points. This is achieved by employing a variable rotational assignment methodology with respect to the interconnect layers or levels during the IC fabrication operation. These techniques thus eliminate the litho step problem, reduce interconnect distances and lessen the influence of capacitance interaction between interconnect wires.
Claims10
A method for use in fabricating at least a portion of an integrated circuit, the method comprising the steps of:
- assigning one or more interconnect lines associated with the integrated circuit which are non-horizontal and non-vertical to at least one metal mask layer separate from at least another metal mask layer assigned to at least one of horizontal interconnect lines and vertical interconnect lines;
- rotating each of the one or more non-horizontal/non-vertical interconnect lines from an original orientation by a predetermined angle determined by the original line orientation so that the one or more non-horizontal/non-vertical interconnect lines are at least one of horizontally and vertically oriented;
- and
- printing the one or more rotated non-horizontal/non-vertical interconnect lines on the at least one metal mask layer assigned thereto.
A method for use in fabricating at least a portion of an integrated circuit, the method comprising the steps of:
- assigning one or more interconnect features associated with the integrated circuit which are non-horizontal and non-vertical to at least one metal mask layer separate from at least another metal mask layer assigned to at least one of horizontal interconnect features and vertical interconnect features;
- rotating each of the one or more non-horizontal/non-vertical interconnect features from an original orientation by a predetermined angle determined by the original feature orientation so that the one or more non-horizontal/non-vertical interconnect features are at least one of horizontally and vertically oriented;
- and
- printing the one or more rotated non-horizontal/non-vertical interconnect features on the at least one metal mask layer assigned thereto.
Dependencies are inferred from the claim text.