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US 6,586,159 B2Granted
Method for using a coated fluoropolymer substrate pellicle in semiconductor fabrication
AssigneeDuPont Photomasks, Inc.
InventorJoseph S. Gordon
Life of this patent
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Abstract
A dust cover having a film with an inorganic, anti-reflective coating and method for use during semiconductor fabrication. The dust cover is primarily for use during photolithography. The dust cover may include an amorphous fluoropolymer film having an inorganic, anti-reflective coating attached to a frame. The inorganic, anti-reflective coating preferably has a refractive index below 1.4.
Claims20
A method for fabricating a semiconductor device, comprising:
- placing an inorganic anti-reflective coating on a film, the antireflective coating having a refractive index less than or equal to 1.2;
- attaching the film to a same to form a dust cover;
- coupling the dust cover to a photomask;
- and
- exposing the dust cover and the photomask to radiant energy.
2 more elements
A method for fabricating a semiconductor device comprising:
- applying an inorganic anti-reflective coating to a fluoropolymer substrate having a top and bottom surface, the anti-reflective coating having a refractive index less than or equal to 1.2;
- coupling the coated fluoropolymer substrate to a frame operable to support the coated fluoropolymer substrate to for a dust cover;
- resting the dust cover on a reticle;
- positioning a semiconductor wafer proximate the reticle;
- and
- applying radiant energy to the semiconductor wafer through the dust cover and reticle.
3 more elements
A method for fabricating a semiconductor device comprising:
- coupling a fluoropolymer substrate coated with an inorganic anti-reflective coating having a refractive index less than or equal to 1.2 to a frame to form a dust cover;
- resting the dust cover on a photomask;
- positioning a semiconductor wafer proximate the photomask;
- and
- exposing the semiconductor wafer to radiant energy.
2 more elements
Dependencies are inferred from the claim text.