Electrostatically attracting electrode and a method of manufacture thereof
AssigneeHitachi, Ltd.
InventorsKazue Takahasi, Youichi Itou, Saburo Kanai, Seiichiro Kanno
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AssigneeHitachi, Ltd.
InventorsKazue Takahasi, Youichi Itou, Saburo Kanai, Seiichiro Kanno
Estimating the term…
The present invention allows the electrostatically attracting electrode, whose size corresponds to large diameter wafers, to be fabricated easily and with precision. The first electrode is provided with a recess in which to install the second electrode. An insulating film is formed in the recess and then the second electrode is securely fitted in the recess. The assembled electrode is machined to make the surfaces of the first and second electrodes flush with each other in the same plane. The flat surfaces are covered with the sprayed electrostatic attraction film, which is the polished until it has a predetermined thickness. This fabrication process allows the electrostatic attraction electrode suitable to large-diameter wafers.
An electrostatic chuck for holding a substrate comprising:
An electrostatic chuck for holding a substrate comprising:
A method of manufacturing an electrostatic chuck for holding a substrate comprising the steps of:
Dependencies are inferred from the claim text.