Method and apparatus for evaluating insulating film
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKoji Eriguchi, Yukiko Hashimoto, Akio Watakabe
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Abstract
There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
Claims5
An apparatus for evaluating an insulating film provided on a conductor layer in a semiconductor substrate for characteristics or dimensions thereof, the apparatus comprising:
- a measuring member having one or more conductor bumps and a wire connected to each of the conductor bumps;
- and
- pressing-force adjusting means for adjusting a relative pressing force exerted on each of the conductor bumps and the insulating film such that the relative pressing force falls within a specified range;
- wherein the conductor bumps come into contact with the insulating film when the insulating film is evaluated, and wherein a MIS structure comprising the insulating film is provided interposed between the conductor bumps and the semiconductor substrate.
Dependencies are inferred from the claim text.