US 6,583,638 B2 · Temperature-controlled semiconductor wafer chuck system

Abstract

A temperature-controlled semiconductor wafer chuck system, the chuck being configured for mounting on a prober stage of a wafer probe test station, the chuck having a top surface and a bottom surface and including a heat sink configured for removing thermal energy from the chuck, a primary heater configured to add heat to the chuck adjacent the top surface of the chuck and a secondary heater adjacent the bottom of the chuck, whereby the temperature of the top surface of the chuck and the bottom of the chuck can be independently controlled; and wherein the chuck can include a plurality of layers above the heat sink which are connected so as to accommodate differential expansion and contraction and thereby minimize distortion of the chuck due to thermal effects; and wherein the heat sink and associated layers integrally connected are configured to stiffen the chuck and resist deformation due to forces applied to the chuck by probe pins.

Claims35

Dependent claims

A temperature-controlled semiconductor wafer chuck system, the chuck having a first side configured to support a semiconductor wafer and a second side configured for mounting on a prober stage, comprising:

a heat sink, including a cooler, the heat sink being intermediate the first and second sides;
a primary heater disposed adjacent the first side for heating the semiconductor wafer;
a secondary heater disposed adjacent the second side for heating the prober stage;
a first temperature sensor adjacent the first side for measuring the temperature near the semiconductor wafer;
a second temperature sensor adjacent the second side measuring the temperature near the prober stage;
a controller configured to receive signals from the first and second temperature sensors and independently control the primary and secondary heaters;
and wherein the controller adjusts the secondary heater according to the signals received from the second temperature sensor to shield the prober stage from thermal effects during testing.

4 more elements

A temperature-controlled semiconductor wafer chuck system including a chuck for supporting wafers under test in a probing station having a top side and a bottom side, comprising:

a heat sink having a top side;
a top plate adjacent the top side of the chuck;
an isolation layer intermediate the top plate and the heat sink;
an differential expansion accommodation joint between the top plate and the isolation layer;
and,
an differential expansion accommodation joint between the isolation layer and the heat sink;
whereby deformation of the top plate of the chuck due to differential expansion and contraction of the heat sink, isolation layer and top plate is minimized.

4 more elements

Dependencies are inferred from the claim text.

Temperature-controlled semiconductor wafer chuck system

Life of this patent

Temperature-controlled semiconductor wafer chuck system

Life of this patent

Abstract

Claims35