Microdevice fabrication method using regular arrays of lines and spaces
AssigneeAdvanced Micro Devices, Inc.
InventorLuigi Capodieci
Life of this patent
Estimating the term…
Abstract
A method of fabricating a microdevice having the steps of forming a first regular array of lines and spaces from a first layer of material deposited on a substrate; patterning the first regular array of lines and spaces to form a first portion of a microdevice component; providing an intermediate layer over the first portion of the microdevice component; forming a second regular array of lines and spaces from a second layer of material deposited on the intermediate layer; patterning the second regular array of lines and spaces to form a second portion of the microdevice component; and forming contact holes in the intermediate layer to establish conductivity between the first portion of the microdevice component and the second portion of the microdevice component.
Claims25
A method of fabricating a plurality of microdevices, comprising the steps of:
- forming a first regular array of lines and spaces from a first layer of material formed on a substrate, wherein widths of all of the lines of the first regular array are substantially the same as a first line width and widths of all of the spaces of the first regular array are substantially the same as a first space width;
- patterning the first regular array of lines and spaces to form a plurality of first microdevice components, each first microdevice component corresponding to one of the plurality of microdevices;
- providing an intermediate layer over the first microdevice components;
- forming a second regular array of lines and spaces from a second layer of material formed on the intermediate layer, wherein widths of all of the lines of the second regular array are substantially the same as a second line width and widths of all of the spaces of the second regular array are substantially the same as a second space width;
- patterning the second regular array of lines and spaces to form a plurality of second microdevice components, each second microdevice component corresponding to one of the plurality of first microdevice components;
- and
- forming contact holes in the intermediate layer to establish conductivity between each associated first microdevice component and second microdevice component.
A method of fabricating a microdevice, comprising the steps of:
- providing a substrate;
- providing a uniform layer of material on the substrate;
- forming a regular array of lines and spaces from the layer of material, each of the lines having a width substantially the same as every other line of the regular array and each of the spaces having a width substantially the same as every other space of the regular array;
- patterning the regular array of lines and spaces to form a set of interconnects;
- forming a plurality of microdevice components on the substrate adjacent the patterned regular array of lines and spaces;
- and
- connecting each microdevice component to at least one interconnect.
Dependencies are inferred from the claim text.