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US 6,582,859 B2Granted
Dust cover for use in semiconductor fabrication
AssigneeDuPont Photomasks, Inc.
InventorJoseph S. Gordon
Life of this patent
Estimating the term…
Abstract
A dust cover having a film with an inorganic, anti-reflective coating and method for use during semiconductor fabrication. The dust cover is primarily for use during photolithography. The dust cover may include an amorphous fluoropolymer film having an inorganic, anti-reflective coating attached to a frame. The inorganic, anti-reflective coating preferably has a refractive index below 1.4.
Claims20
A dust cover, comprising:
- a frame attached to a film;
- the film comprising a fluoropolymer substrate with an inorganic anti-reflective coating;
- and
- the inorganic anti-reflective coating having a refractive index less than or equal to 1.2.
1 more element
A dust cover comprising:
- a frame operable to support a film having a fluoropolymer substrate;
- the fluoropolymer substrate having respective top and bottom surfaces and an inorganic anti-reflective coating on at least one surface;
- and
- the inorganic anti-reflective coating having a refractive index less than or equal to 1.2.
1 more element
A dust cover for use in fabricating a semiconductor device comprising:
- a frame operable to support a fluoropolymer substrate;
- the fluoropolymer substrate having a top surface and a bottom surface;
- a first inorganic anti-reflective coating on the top surface of the fluoropolymer substrate;
- a second inorganic anti-reflective coating on the bottom surface of the fluoropolymer substrate;
- and
- at least the first inorganic anti-reflective coating having a refractive index less than or equal to 1.2.
3 more elements
Dependencies are inferred from the claim text.