Robot for handling semiconductor wafers

A multi-set robot adapted to transfer multiple substrates comprising:

• a first robot set comprising:
• a first motor coupled to a first rotatable member that is rotatable about an axis of rotational symmetry;
• a second motor coupled to a second rotatable member that is rotatable about the axis of rotational symmetry;
• a first plurality of blades vertically spaced from one another and each adapted to support a substrate;
• and
• a first linkage adapted to enable coordinated movement of the first plurality of blades on rotation of the first and second rotatable members, the first linkage comprising a first arm assembly and a second arm assembly each coupled to the first and second rotatable members;
• at least a second robot set positioned above the first robot set comprising:
• a third motor coupled to a third rotatable member that is rotatable about the axis of rotational symmetry;
• a fourth motor coupled to a fourth rotatable member that is rotatable about the axis of rotational symmetry;
• a second plurality of blades vertically spaced from one another and each adapted to support a substrate;
• and
• a second linkage adapted to enable coordinated movement of the second plurality of blades on rotation of the third and fourth rotatable members, the second linkage comprising a third arm assembly and a fourth arm assembly each coupled to the third and fourth rotatable members;
• a first rotatable shaft that extends from the fourth motor through the first robot set to the fourth rotatable member of the second robot set;
• and
• a second rotatable shaft which surrounds the first rotatable shaft and that extends from the third motor through the first robot set to the third rotatable member of the second robot set;
• wherein the first plurality of blades comprises:
• a first blade coupled to the first and second arm assemblies by a first wrist, the first wrist configured to allow complete retraction of the first blade by the first robot set;
• and
• a second blade coupled to the first and second arm assemblies by a second wrist, the second wrist configured to allow complete retraction of the second blade by the first robot set;
• and
• wherein the second plurality of blades comprises:
• a third blade coupled to the third and fourth arm assemblies by a third wrist, the third wrist configured to allow complete retraction of the third blade by the second robot set;
• and
• a fourth blade coupled to the third and fourth arm assemblies by a fourth wrist, the fourth wrist configured to allow complete retraction of the fourth blade by the second robot set.

A processing tool for semiconductor device fabrication having:

• a transfer chamber;
• a loadlock coupled to the transfer chamber and adapted to provide substrates to the transfer chamber;
• a first plurality of processing chambers coupled to the transfer chamber and adapted to receive substrates from the transfer chamber at a first elevation or lower;
• a second plurality of processing chambers coupled to the transfer chamber and adapted to receive substrates from the transfer chamber at an elevation above the first elevation;
• and
• a transfer mechanism located within the transfer chamber and having:
• a first robot set adapted to rotate about an axis and to transfer substrates between the first plurality of processing chambers;
• and
• a second robot set positioned above the first robot set and adapted to rotate about the axis and to transfer substrates between the second plurality of processing chambers independent of the first robot set.

A method of operating independently controllable robot sets in a multi-set robot comprising:

• providing a multi-set robot having at least a first robot set with a first plurality of blades for supporting substrates and a second robot set positioned above the first robot set, the second robot set having a second plurality of blades for supporting substrates;
• employing the first and second robot sets to simultaneously extract a first substrate from a first loadlock and a second substrate from a second loadlock;
• employing the first and second robot sets to simultaneously load the first substrate into a first processing chamber having a first chamber opening height and the second substrate into a second processing chamber having a second chamber opening height;
• and
• employing the first and second robot sets to independently adjust a position of the first substrate within the first processing chamber and a position of the second substrate within the second processing chamber.