Die bonding device
AssigneeNidec Tosok Corporation
InventorsYoshiyuki Kawashima, Hiroshi Nitta, Masanori Izumi
Life of this patent
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Abstract
A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.
Claims7
A die bonding device for mounting an electronic component on a metal stem, characterized by
- a bonding nozzle for suctioning said electronic component and positioning said electronic component on a component mounting face of said stem;
- a stem carrying head for carrying said stem;
- a heater section for heating while said electronic component positioned on said component mounting face of said stem to mount said electronic component on said stem;
- and
- an imaging camera having a light axis extending through said component mounting face of said stem when positioned inside said heater section, which performs reciprocating motion in the direction of said light axis.
A die bonding device for fixing an electronic component onto a component mounting face of a stem, characterized by
- heating means for bonding said electronic component with said component mounting face, by means of heating;
- imaging means for imaging the position of said component mounting face of said stem positioned in position in said heating means;
- locating means for locating said electronic component on said component mounting face of said stem positioned in said heating means, on the basis of the positional information for said component mounting face imaged by said imaging means;
- and
- moving means for moving said imaging means along the direction of the light axis of said imaging means, to a location where the moving means does not impede to mount of said electronic component onto said component mounting face.
Dependencies are inferred from the claim text.