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US 6,578,893 B2Granted
Apparatus and methods for handling semiconductor wafers
AssigneeAJS Automation, Inc.
InventorsAlan J. Soucy, James S. Castantini
Life of this patent
Estimating the term…
Abstract
Disclosed are apparatus and methods used for handling semiconductor wafers or similar articles. In particular, the apparatus disclosed is capable of flexibly gripping items of various shapes and sizes in a manner that substantially reduces or eliminates the likelihood of damage thereto. The apparatus is particularly suited to being used as a robotic end effector for handling wafers using edge-gripping techniques.
Claims12
An apparatus for handling wafers, comprising:
- an end effector including at least one arm;
- a unitary flexure joint;
- and
- a force element, wherein said end effector is forced open by contact with a wafer.
1 more element
A method of handling wafers comprising the steps of:
- moving an end effector into contact with a wafer;
- and
- applying a force to the end effector, thereby causing a unitary flexure joint to flex and at least one arm of the end effector to rotate outwardly, and wherein the applied force moves the end effector around the wafer.
Dependencies are inferred from the claim text.