Windows used in thermal processing chambers
AssigneeMattson Technology, Inc.
InventorsConor Patrick O'Carroll, Rudy Santo Tomas Cardema, James Tsuneo Taoka, Zion Koren
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Abstract
An apparatus for heat treating semiconductor wafers in a thermal processing chamber using light energy is provided. In one embodiment, the apparatus contains a window located between the semiconductor wafer and the energy source. The window contains a member that defines at least one passage capable of being placed into communication with a coolant to cool the window and at least partially offset the “first wafer effect”. Additionally, in some embodiments, the window has a thickness greater than about 1 inch so that it can withstand pressures applied during wafer processing.
Claims41
An apparatus for heating a semiconductor wafer comprising:
- a thermal processing chamber adapted to contain the semiconductor wafer;
- an energy source in communication with said thermal processing chamber for heating said semiconductor wafer contained in said chamber;
- and
- a window positioned between said energy source and said semiconductor wafer, said window containing a material that is capable of allowing thermal radiation at a first preselected wavelength to pass therethrough, said window containing a first member having a first side facing said semiconductor wafer and a second side facing said energy source, said first member defining at least one passage that is capable of being placed into communication with at least one coolant.
An apparatus for heating a substrate comprising:
- a thermal processing chamber adapted to contain the substrate;
- an energy source in communication with said thermal processing chamber for heating said substrate contained in said chamber;
- and
- a window positioned between said energy source and said substrate, said window including a material that is capable of allowing thermal radiation at a first preselected wavelength to pass therethrough, said material being selected from the group consisting of quartz, sapphire, fused silica, and combinations thereof, said window containing a first member having a first side facing said substrate and a second side facing said energy source, said first member defining a plurality of passages that are capable of being placed into communication with at least one coolant.
A method for heat treating a semiconductor wafer, said method comprising:
- providing a heat treating apparatus comprising,
- i) a thermal processing chamber adapted to contain the semiconductor wafer;
- ii) an energy source in communication with said thermal processing chamber for heating said semiconductor wafer contained in said chamber;
- and
- iii) a window positioned between said energy source and said semiconductor wafer, said window including a material that is capable of allowing thermal radiation at a first preselected wavelength to pass therethrough, said window containing a first member having a first side facing said semiconductor wafer and a second side facing said energy source, said first member defining at least one passage;
- heating said semiconductor wafer to a certain temperature with said energy source;
- and
- supplying at least one coolant to said passage defined by said first member to cool said window.
Dependencies are inferred from the claim text.