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US 6,556,955 B2Granted
Method of determining lethality of defects in circuit pattern inspection, method of selecting defects to be reviewed, and inspection system of circuit patterns involved with the methods
AssigneeHitachi, Ltd.
InventorsYasuhiro Yoshitake, Masataka Shiba, Atsushi Shimoda
Life of this patent
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Abstract
A method of reviewing defects on a substrate. The method includes inputting information of defects on a substrate detected by a detection apparatus, identifying cluster of defects detected on the substrate by using the inputted information, selecting defects to be reviewed from the cluster identified, reviewing the selected defects, and classifying the reviewed defects.
Claims14
A method of reviewing defects, comprising the steps of:
- inputting information of defects on a substrate including coordinate data and size of the defects detected by a detection apparatus;
- identifying cluster of defects detected on the substrate by using the inputted information;
- selecting defects to be reviewed from the cluster identified;
- reviewing the selected defects;
- and
- classifying the reviewed defects.
3 more elements
A method of reviewing defects, comprising the steps of:
- inputting coordinate data and size data of defects on a substrate on which a circuit pattern is formed and detected by a detection apparatus;
- determining lethality of defects detected on the substrate by using the inputted information;
- selecting defects to be reviewed from lethal defects whose lethality is determined in the step of determining;
- reviewing the selected defects;
- and
- classifying the reviewed defects.
3 more elements
A method of reviewing defects, comprising the steps of:
- inputting coordinate data and size data of defects a substrate processed in a processing step and detected by a detection apparatus;
- selecting defects to be reviewed from lethal defects whose lethality is determined by using the inputted coordinate data and size data of defects by using an analysis system;
- and
- reviewing the selected defects and classifying the selected defects by a reviewing apparatus.
1 more element
Dependencies are inferred from the claim text.