Electrically shielded glass lid for a packaged device
AssigneeAnalog Devices, Inc.
InventorMaurice S. Karpman
Life of this patent
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Abstract
A packaged device includes a package substrate and a plurality of optical structures formed on a semiconductive substrate and positioned on the package substrate, forming an active area. The packaged device further includes a contiguous solderable seal structure surrounding the plurality of optical structures and a cap formed over the plurality of optical structures and upon the contiguous solderable seal structure. The cap has, formed thereon, patterned metalization. The patterned metalization is located over the active area.
Claims31
A packaged device, comprising:
- a package substrate;
- a plurality of optical structures formed on a semiconductive substrate and positioned on said package substrate, forming an active area;
- a contiguous solderable seal structure surrounding said plurality of optical structures;
- and
- a cap formed over said plurality of optical structures and upon said contiguous solderable seal structure;
- said cap having, formed thereon, patterned metalization, said patterned metalization being located over said active area.
A metalized glass lid for an optical die, comprising:
- a glass portion;
- and
- a metalization adjacent to said glass portion;
- said metalization having clear apertures;
- said metalization being connected to a DC voltage.
An optical device, comprising:
- a plurality of optical structures formed on a semiconductive substrate, said plurality of optical structures forming an active area;
- and
- a cap formed over said plurality of optical structures;
- said cap having, formed thereon, patterned metalization, said patterned metalization being located over said active area.
Dependencies are inferred from the claim text.