Earth ground terminal
AssigneeTyco Electronics Logistics AG
InventorIzuru Kumagai
Life of this patent
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Abstract
An earth ground terminal provides an electroconductive substrate part and an electroconductive spring contact which protrudes integrally from one edge of the substrate part toward the side opposite to the substrate part. Through holes which have undergone a burring process are formed in the aforementioned substrate part. The earth ground terminal is used to prevent electromagnetic inductive interference, high-frequency inductive interference, etc. The earth ground terminal is effective when a printed substrate is grounded by a shield plate or a chassis.
Claims4
An earth ground terminal comprising an electroconductive substrate part and an electroconductive spring contact which protrudes integrally from one edge of the substrate part toward the side opposite to the substrate part, and through holes that have undergone a burring process are formed on the substrate part, said through holes being defined by a protruding cylindrical shape forming an inner solder attachment surface.
Dependencies are inferred from the claim text.