Fabricating an electrical metal fuse
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorTa-Lee Yu
Life of this patent
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Abstract
A method for forming an electrical metal fuse for use with a semiconductor integrated circuit device. At least two varying trench metal depths may be formed on a substrate to configure the electrical metal fuse thereon. Additionally, at least two different widths of single metal lines, may be configured on the substrate. As a result of the two different trench depths and two different widths of metal formed thereon to create the electrical metal fuse, increases in current density gradients and thermal gradients thereof can be generated. The trench metal depths and width of metal are formed from copper. The electrical metal fuse generally comprises a current density ratio greater than 10 to 1.
Claims12
A method for forming an electrical metal fuse for use with a semiconductor integrated circuit device, said method comprising the steps of:
- forming at least two varying trench metal depths of a metal on a substrate to configure an electrical metal fuse thereon;
- and
- thereafter configuring at least two different widths of single metal lines of a metal to thereby generate increases in current density gradients and thermal gradients thereof, wherein said electrical metal fuse comprises a current density ratio greater than 10:1.
A method for forming an electrical metal fuse for use with a semiconductor integrated circuit device, said method comprising the steps of:
- forming at least two varying trench metal depths of a metal on a substrate to configure an electrical metal fuse thereon, wherein said at least two varying trench metal depths comprises at least two varying trench depths of copper;
- configuring at least two different widths of single metal lines to generate an increase in current density gradients and thermal gradients thereof, such that said electrical metal fuse comprises a current density ratio greater than 10:1 and wherein said at least two different widths of single metal lines of a metal comprises at least one metal width that is thinner than at least one other metal width thereof.
Dependencies are inferred from the claim text.