Double-packaged multichip semiconductor module

A method for fabricating a multi-chip-module comprising:

• a) providing a plurality of semiconductor packages, each package comprising a plurality of package leads and a semiconductor die in electrical communication with the package leads;
• b) testing each package by performing functionality testing, adherence to required specifications testing, and burn-in testing;
• c) providing a housing comprising a recess, a plurality of external leads and a plurality of conductive traces in electrical communication with the external leads;
• d) placing passing packages from the testing step within the recess and placing a conductive polymer between package leads on the passing packages and the conductive traces;
• and
• e) attaching a lid to the housing to hermetically seal the passing packages within the housing.

A method for fabricating a multi chip module comprising:

• providing a plurality of packaged semiconductor memory devices;
• testing the devices by performing functionality testing, adherence to required specifications testing, and burn-in testing;
• retaining passing devices from the testing step;
• providing a housing comprising a plurality of external leads and a plurality of conductive traces in electrical communication with the external leads;
• mounting the passing devices within the housing and electrically attaching selected package leads on the passing devices to corresponding conductive traces on the housing;
• and
• following mounting, hermetically sealing the passing devices within the housing.