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US 6,555,290 B1Granted
Photosensitive resin composition and photosensitive element using the same
AssigneeHitachi Chemical Company, Ltd.
InventorsTatsuya Ichikawa, Tatsuo Chiba
Life of this patent
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Abstract
A photosensitive resin composition comprising (A) a binder polymer having carboxyl groups, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C) a photoinitiator can provide a film excellent in mechanical strength, chemical resistance, flexibility, and suitable for producing a photosensitive element.
Claims4
A photosensitive resin composition comprising:
- (A) a binder polymer having carboxyl groups;
- (B) at least one photopolymerizable compound having a ring of the formula:
- and a terminal group of the formula:
- wherein R3 is a hydrogen atom or a methyl group;
- and wherein the terminal group is bound to each N atom of the ring via a group represented by the formula:
- wherein R1 is an alkylene group;
- X is an alkylene oxide group;
- or
- and n is an integer of 1 to 14, and
- (C) a photoinitiator containing a 2,4,5-triphenylimidazole dimer.
7 more elements
Dependencies are inferred from the claim text.