Multi-layer printed circuit board and method of making same

A method of manufacturing a printed circuit board having at least two conductor patterns and reducing interfacial shear stresses, comprising:

• providing a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness, and a bottom layer forming a second major surface opposed to the first major surface, each of the layers comprised of a material etchable in a respective given etchant;
• disposing a first etch resist on the first surface corresponding to a reverse image of a first conductor pattern;
• disposing a second etch resist on the second surface corresponding to a reverse image of a second conductor pattern;
• etching the first and second surfaces in each said respective given etchant to form said first and second conductor patterns;
• removing the first and second etch resists;
• securing a compliant adhesive layer comprising a low modulus material to the second surface so that the bottom layer becomes embedded in one major surface of the adhesive layer;
• securing the other major surface of the adhesive layer to one major surface of a base;
• and
• selectively etching the middle layer in said given etchant to isolate selected portions of the first and second surfaces and define interconnect regions therebetween having a height equal to said predetermined thickness;
• wherein selecting the low modulus material and selecting the thickness of the middle layer are reducing interfacial shear stresses.