Wafer holder for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus using the same
AssigneeSumitomo Electric Industries, Ltd.
InventorsAkira Kuibira, Hirohiko Nakata
Life of this patent
Estimating the term…
Abstract
A wafer holder is configured of a pair of ceramic base members and conductive layers each posed between the ceramic base members. The conductive layer has a body facing a wafer and an extension protruding from the body to the outside of a vacuum chamber for external electrical connection, wherein the body and the extension are arranged in a single plane. Thus there can be obtained a wafer holder for use with a semiconductor manufacturing apparatus that can reduce such distortion as caused when it is heated and cooled and that can also be readily manufactured.
Claims42
A wafer holder for a semiconductor manufacturing apparatus including an enclosed processing chamber in which said wafer holder is arranged, said wafer holder comprising a conductive layer and a pair of ceramic base members sandwiching said conductive layer therebetween, wherein:
- said conductive layer has a body arranged at a surface opposite a wafer holding surface of one of said ceramic base members and an extension protruding from said body outwardly from the chamber to outside of the chamber for enabling an external electrical connection with said extension;
- and
- said body and said extension are arranged substantially in a single plane.
A wafer bolder for a semiconductor manufacturing apparatus including an enclosed processing chamber in which said wafer holder is arranged, said wafer holder comprising a ceramic base member, a conductive layer provided on said ceramic base member and a protection layer covering said conductive layer, wherein:
- said conductive layer has a body arranged at a surface opposite a wafer holding surface of said ceramic base member and an extension protruding from said body outwardly from the chamber to outside of the chamber for enabling an external electrical connection with said extension;
- and
- said body and said extension are arranged substantially in a single plane.
A semiconductor manufacturing apparatus comprising:
- a vacuum chamber;
- and
- a wafer holder comprising a first ceramic base member and a first electrically conductive member;
- wherein:
- said ceramic base member includes a wafer holding portion and a lateral protruding plate portion that protrudes laterally from said wafer holding portion along a common plane therewith;
- said wafer holding portion has a wafer holding surface adapted to support a semiconductor wafer thereon, and a back surface opposite said wafer holding surface;
- said electrically conductive member integrally includes a conductive body arranged on said back surface of said wafer holding portion of said ceramic base member, and a conductive extension protruding integrally laterally from said conductive body along said lateral protruding plate portion on a common plane with said conductive body;
- and
- said wafer holding portion of said ceramic base member and said conductive body of said electrically conductive member are arranged in said vacuum chamber, and said protruding plate portion of said ceramic base member and said conductive extension of said electrically conductive member protrude laterally outwardly out of said vacuum chamber, enabling an electrical connection to be made with said conductive extension outside of said vacuum chamber.
Dependencies are inferred from the claim text.