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US 6,553,792 B1Granted
Resist stripping method and apparatus
AssigneeAsahi Sunac Corporation
InventorsMasahiko Amari, Yoshiyuki Seike
Life of this patent
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Abstract
A method and an apparatus capable of stripping resist efficiently in a short amount of time. A stripping solution under high pressure is jetted from a nozzle to a rotating wafer. The resist layer on the wafer is applied with the jetted stripping solution, and the resist layer can be efficiently stripped in a short amount of time by the multiplied effect by the physical effect caused by the impact of the jetted stripping solution and the chemical effect of the stripping solution.
Claims5
An apparatus for stripping resist from a substrate, comprising:
- a table for supporting the substrate;
- and
- a jetting device for jetting stripping solution to the substrate on the table at sufficiently high fluid pressure to achieve a collective removal effect of physically cracking the resist due to the impact of the jetted fluid without damaging the substrate combined with a chemical removal by the stripping solution of the resist from the substrate.
Dependencies are inferred from the claim text.