Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

A manufacturing method for integrated circuit devices from semiconductor wafers comprising:

• providing a plurality of semiconductor wafers;
• fabricating a plurality of devices on each semiconductor wafer of the plurality of semiconductor wafers;
• causing each device of the devices on each semiconductor wafer of the plurality of semiconductor wafers to store a substantially unique identification code;
• storing data using the substantially unique identification code of each device of the devices for identifying manufacturing procedures for the devices;
• separating each of the devices on each semiconductor wafer of the plurality of semiconductor wafers for forming one die of a plurality of dice;
• assembling each die of the plurality of dice into a semiconductor device, the assembling including:
• picking each die of the plurality of dice from its semiconductor wafer;
• placing each die of the plurality of dice onto an epoxy-coated bonding site of one lead frame of a plurality of lead frames;
• curing the epoxy on the bonding site of each lead frame of the plurality of lead frames;
• wire bonding each die of the plurality of dice to an associated lead frame;
• encapsulating each die of the plurality of dice and its associated lead frame for forming one package of a plurality of packages, each package having projecting leads;
• curing each package of the plurality of packages;
• deflashing the projecting leads of each package of the plurality of packages;
• electroplating the projecting leads of each package of the plurality of packages;
• and
• singulating each package of the plurality of packages into one semiconductor device package of a plurality of semiconductor device packages;
• automatically reading the substantially unique identification code associated with each semiconductor device package of the plurality of semiconductor devices packages;
• and
• accessing the data stored using the substantially unique identification code associated with each semiconductor device package of the plurality of semiconductor device packages.

A method of manufacturing Multi-Chip Modules from semiconductor wafers comprising:

• fabricating a plurality of semiconductor devices on each semiconductor wafer of a plurality of semiconductor wafers, each semiconductor device comprising a Dynamic Random Access Memory;
• causing each of the semiconductor devices on each semiconductor wafer of the plurality of semiconductor wafers to store a substantially unique identification code;
• storing data in association with the substantially unique identification code of each semiconductor device of the plurality of semiconductor devices for identifying manufacturing procedures for the plurality of semiconductor devices, the storing data including storing data for identifying repairs performed on each semiconductor device and for identifying spare rows and columns available to effect repairs in each semiconductor device;
• separating each semiconductor device of the plurality of semiconductor devices on each semiconductor wafer of the plurality of semiconductor wafers from its semiconductor wafer for forming one semiconductor device of the plurality of semiconductor devices;
• assembling at least two semiconductor devices into each Multi-Chip-Module of a plurality of Multi-Chip-Modules;
• automatically reading the substantially unique identification code of each semiconductor device of the semiconductor devices in each Multi-Chip-Module of the plurality of Multi-Chip-Modules;
• and
• accessing the data stored using the substantially unique identification code of each semiconductor device of the plurality of semiconductor devices in each Multi-Chip-Module of the plurality of Multi-Chip-Modules.

A manufacturing method for semiconductor devices from semiconductor wafers, the method comprising:

• fabricating a plurality of semiconductor devices on each semiconductor wafer of the semiconductor wafers;
• electronically probing each semiconductor device of the semiconductor devices on each semiconductor wafer of the semiconductor wafers for identifying good, bad and repairable semiconductor devices on each semiconductor wafer of the semiconductor wafers;
• repairing the repairable semiconductor devices;
• programming each semiconductor device of the semiconductor devices on each semiconductor wafer of the semiconductor wafers to store a unique fuse identification;
• storing data in association with the unique fuse identification of each semiconductor device of the semiconductor devices identifying repairs performed on each semiconductor device of the semiconductor devices;
• mounting each semiconductor wafer of the semiconductor wafers on an adhesive film;
• sawing each semiconductor device of the semiconductor devices on each semiconductor wafer of the semiconductor wafers for forming one of a plurality of discrete semiconductor devices;
• automatically picking each discrete semiconductor device of the semiconductor devices from a semiconductor wafer of the semiconductor wafers;
• placing each discrete semiconductor device of the semiconductor devices onto an epoxy-coated bonding site of one lead frame of a plurality of lead frames;
• curing the epoxy on the bonding site of each lead frame of the plurality of lead frames;
• wire bonding each discrete semiconductor device of the semiconductor devices to an associated lead frame;
• encapsulating each discrete semiconductor device of the semiconductor devices and its associated lead frame for forming one semiconductor device package of a plurality of semiconductor device packages, each semiconductor device package having projecting leads;
• curing each semiconductor device package of the plurality of semiconductor device packages;
• deflashing the projecting leads of each semiconductor device package of the plurality of semiconductor device packages;
• electroplating the projecting leads of each semiconductor device package of the plurality of semiconductor device packages;
• singulating each semiconductor device package of the plurality of semiconductor device packages;
• testing each semiconductor device package of the plurality of semiconductor devices for opens and shorts;
• burn-in testing each semiconductor device package of the plurality of semiconductor device packages;
• back-end testing each semiconductor device package of the plurality of semiconductor device packages;
• automatically reading the unique fuse identification of each semiconductor device package of the semiconductor device packages;
• accessing the data stored using the unique fuse identification of each semiconductor device package of the semiconductor device packages;
• for any semiconductor device package failing any one of the opens/shorts, burn-in, and back-end tests, evaluating the accessed data to determine whether the failing semiconductor device package may be repaired;
• repairing any semiconductor package device determined in accordance with the accessed data to be repairable and returning the repaired semiconductor device package to the semiconductor manufacturing process;
• discarding any of the semiconductor device packages determined in accordance with the accessed data to be unrepairable;
• and
• receiving at least one unrepairable semiconductor device diverted from another manufacturing method for assembly into semiconductor devices.

A manufacturing method for Multi-Chip Modules from semiconductor wafers using Chip-On-Board techniques, the method comprising:

• electronically probing each of a plurality of semiconductor devices on each semiconductor wafer of a plurality of semiconductor wafers for identifying good, bad and repairable semiconductor devices;
• repairing the repairable semiconductor devices;
• programming each semiconductor device of the semiconductor devices to store a unique fuse identification (ID);
• storing an electronic wafer map for each semiconductor wafer that identifies the locations of good and bad semiconductor devices on the semiconductor wafer using the unique fuse ID of each semiconductor device;
• storing data in association with the unique fuse ID of each semiconductor device of the semiconductor devices identifying repairs;
• mounting each semiconductor wafer of the plurality of semiconductor wafers on an adhesive film;
• sawing each semiconductor wafer of the plurality of semiconductor wafers, forming a plurality of discrete semiconductor dice;
• accessing the stored electronic wafer map for each semiconductor wafer of the plurality of semiconductor wafers;
• accessing the stored data for each semiconductor device of the plurality of semiconductor devices;
• automatically picking each of the good semiconductor device from each semiconductor wafer of the plurality of semiconductor wafers;
• discarding non-picked semiconductor devices identified as bad by the accessed wafer maps;
• diverting picked semiconductor devices identified as good but unrepairable by the accessed wafer maps and data to a non-MCM semiconductor manufacturing process;
• placing picked semiconductor devices identified as good and repairable by the accessed wafer maps onto epoxy-coated bonding sites of a plurality of printed circuit boards using COB techniques to form a plurality of MCM's;
• curing the epoxy on the bonding sites;
• cleaning at least one MCM of the plurality of MCM's;
• wire bonding each semiconductor device of the semiconductor devices to its associated MCM of the plurality of MCM's;
• testing each semiconductor device of the semiconductor devices on each of the MCM's for opens and shorts;
• encapsulating each semiconductor device of the semiconductor devices;
• retesting each semiconductor device of the semiconductor devices for opens and shorts;
• burn-in testing each semiconductor device of the semiconductor devices;
• back-end testing each semiconductor device of the semiconductor devices;
• automatically reading the unique fuse ID of each semiconductor device;
• accessing the data stored in association with the unique fuse ID of each semiconductor device of the semiconductor devices;
• for any semiconductor device failing any one of the opens/shorts, burn-in, and back-end tests, evaluating the accessed data to determine whether the failing semiconductor device may be repaired;
• repairing any semiconductor device determined in accordance with the accessed data to be repairable and returning repaired MCM's to the manufacturing method;
• and
• replacing any semiconductor device determined in accordance with the accessed data to be unrepairable using a Known Good Die and returning the repaired MCM's to the manufacturing method.

A manufacturing method for Multi-Chip Modules from semiconductor wafers using flip-chip techniques, the method comprising:

• electronically probing each semiconductor device of the semiconductor wafers to identify good, bad and repairable semiconductor devices;
• repairing the repairable semiconductor devices;
• programming each semiconductor device of the semiconductor wafers to store a unique fuse identification;
• storing an electronic wafer map for each semiconductor wafer for identifying locations of good and bad semiconductor devices using the unique fuse ID;
• storing data in association with the unique fuse ID of the semiconductor devices identifying repairs;
• mounting the semiconductor wafers on an adhesive film;
• sawing the semiconductor wafers;
• accessing the stored electronic wafer map for the semiconductor wafers;
• accessing the stored data for each of the semiconductor devices on each of the semiconductor wafers;
• automatically picking the good semiconductor devices;
• discarding non-picked semiconductor devices;
• diverting picked semiconductor devices identified as good but unrepairable by the accessed wafer maps and data to a non-MCM device manufacturing process;
• flip-chip attaching picked semiconductor devices identified as good and repairable by the accessed wafer maps and data to a plurality of MCM's;
• testing the semiconductor devices of the plurality of MCM's for opens and shorts;
• encapsulating the plurality of MCM's;
• retesting the semiconductor devices on the plurality of MCM's for opens and shorts;
• burn-in testing the semiconductor devices of the plurality of MCM's;
• back-end testing the semiconductor devices of the plurality of MCM's;
• automatically reading the unique fuse ID of the semiconductor devices of the plurality of MCM's;
• accessing the data stored in association with the unique fuse ID of the semiconductor devices;
• for any semiconductor device failing any one of the opens/shorts, burn-in, and back-end tests, evaluating the accessed data to determine whether the failing semiconductor device may be repaired;
• repairing any semiconductor device determined in accordance with the accessed data to be repairable and returning repaired MCM's to the manufacturing method;
• replacing any of the semiconductor devices determined in accordance with the accessed data to be unrepairable with a Known Good Die and returning the repaired MCM's to the manufacturing method.

A manufacturing method for a Multi-Chip Module for diverting good but unrepairable semiconductor devices from the method, the MCM having semiconductor devices each having a substantially unique identification code, the method comprising:

• storing data in association with the substantially unique identification code of at least some of the semiconductor devices for identifying semiconductor devices that are good and repairable, that are good but unrepairable, and that are bad;
• automatically reading the substantially unique identification code of at some of the semiconductor devices;
• accessing the data stored in association with the substantially unique identification code of the at least some of the semiconductor devices;
• diverting semiconductor devices identified as good but unrepairable to other semiconductor device manufacturing processes;
• and
• discarding semiconductor devices identified as bad.