US 6,553,137 B1Granted

Method of increasing overlay accuracy in an exposure step and overlay displacement measuring device for determining optimum measurement focus plane by variation in magnitudes of displacement of two overlay inspection marks

AssigneeMitsubishi Denki Kabushiki Kaisha

InventorYoshikatu Tomimatu

Life of this patent

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Abstract

A method of increasing overlay accuracy in an exposure step in a process of manufacturing a semiconductor device for determining a measurement focus plane enabling increase in accuracy for measuring displacement includes steps of: picking up an image of a semiconductor wafer including a plurality of chips each having first and second overlay inspection marks thereon while shifting a focus plane by a predetermined first distance in a predetermined first range with respect to a reference focus plane; calculating a variation in measured values of displacement of the first and second overlay inspection marks for each focus plane; and determining a measurement focus plane by a variations in the measured values.

Claims10

Dependent claims

A method of increasing overlay accuracy in an exposure step in a process of manufacturing a semiconductor device, comprising the steps of:

picking up an image of a semiconductor wafer including a plurality of chips each having first and second overlay inspection marks thereon by shifting a focus plane by a predetermined first distance in a predetermined first range with respect to a reference focus plane;
calculating a variation in measured values of displacement of said first and second overlay inspection marks for each focus plane;
determining a measurement focus plane based on said variations in the measured values;
picking up the image of said semiconductor wafer while shifting the focus plane by a second distance greater than said first distance in a predetermined second range;
and
calculating a variation in the measured values of displacement of said first and second overlay inspection marks for said each focus plane for determining the focus plane producing a minimum variation of said measured values as said reference focus plane,
said step of determining said measurement focus plane including the steps of:
determining said reference focus plane as said measurement focus plane when a range of said variations in the measured values calculated for each focus plane in said first range is at most a predetermined first value;
determining said measurement focus plane in accordance with a first procedure allowing, when said range of said variations in the measured values calculated for each focus plane in said first range is greater than said first value and when there is only one minimal value in a graph defining an abscissa as a focus value and an ordinate as said variation in the measured values, determination of a slice line parallel to said abscissa dividing an interval between said minimal value and a maximum value of said variations in the measured values in said graph in a prescribed ratio, determination of two points at which said slice line and said graph intersect, and determination of a value at an intermediate point between said two points along said abscissa as said measurement focus plane;
and
determining said measurement focus plane in accordance with said first procedure after approximating said graph by a quadratic function when said range of said variations in the measured values calculated for each focus plane in said first range is greater than said first value and when there are a plurality of minimal values in said graph.

8 more elements

An overlay displacement measuring device, comprising:

a camera picking up an image of a semiconductor wafer including a plurality of chips each having first and second overlay inspection marks thereon;
a displacement measuring portion connected to said camera for measuring a magnitude of displacement of said first and second overlay inspection marks for every chip in each focus plane while controlling a focus of said camera;
measured value variation calculating portion connected to said displacement measuring portion for calculating a variation in said measured values of displacement for said each focus plane;
and
a measurement focus plane identifying portion connected to said measured value variation calculating portion for identifying a measurement focus plane by said variations in the measured values,
wherein said measured value variation calculating portion includes:
an average value calculating portion connected to said displacement measuring portion for calculating an average value of said measured values of displacement for each pair of said first and second overlay inspection marks;
a subtraction value calculating portion connected to said displacement calculating portion and said average value calculating portion for obtaining a value by subtracting said average value from said measured value for each measured value of each focus plane;
and
a subtraction value variation calculating portion for calculating a variation in the values obtained by subtracting said average value from said measured values for said each focus plane.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/372,588Filed 12 Aug 1999
Priority: JP 11-1023419 Apr 1999
Granted: 22 Apr 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10P 72/0606
Apparatus for monitoring, sorting, marking, testing or measuring: position monitoring, e.g. misposition detection or presence detection
G03F 7/70633
Monitoring the printed patterns: overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the…
H10P 72/0604
Apparatus for monitoring, sorting, marking, testing or measuring: process monitoring, e.g. flow or thickness monitoring
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered