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US 6,552,906 B2Granted
Radiator for electronic parts, electronic device, electric circuit device, and computer
AssigneeInternational Business Machines Corporation
InventorYoshihisa Kanada
Life of this patent
Estimating the term…
Abstract
To prevent generation of air bubbles in thermal grease 37 when a wired board 24 is bent due to a difference of thermal expansibility between a CPU chip 31 and a heat sink 32 in a CPU package 21, the thermal grease 37 being filled between the CPU chip 31 and a plate member 34 of the heat sink 32. A through-hole 38 is formed almost in the center of a plate member 34 so as to go through the plate member 34.
Claims2
An electronic device, comprising:
- a heat generating element;
- a radiator having a heat receiving surface for receiving heat from said heating generating element, a radiating element for radiating heat transferred from said heat receiving surface, and a first through-hole opened at one end to said heat receiving surface and opened at an opposite end;
- and
- a heat conductive semifluid material being positioned between the heat generating element and said heat receiving surface, wherein said heat conductive semifluid material is driven up and down in said first through-hole in response to changes in temperature.
1 more element
Dependencies are inferred from the claim text.