Angled edge connections for multichip structures
AssigneeMicron Technology, Inc.
InventorPaul A. Farrar
Life of this patent
Estimating the term…
Abstract
A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogonal manner. The first and second chips are electrically interconnected via an interconnect structure comprising a first conductive pillar that extends from an outer surface of the first chip. A distal end of the first pillar is electrically connected to an outer surface of the second chip via a solder ball or another conductive pillar that is interposed between the distal end of the first conductive pillar and the second chip.
Claims23
An integrated circuit module, comprising:
- a first semiconductor structure having a first surface defined by a first plane;
- a second semiconductor structure having a second surface defined by a second plane, wherein the second structure is positioned adjacent the first structure in manner such that the second plane intersects the first plane;
- a first connecting member extending from the first surface of the first structure, the first connecting member having a first distal end electrically connected to the first surface and a second distal end extending from the first surface along a first axis;
- and
- a second connecting member interposed between the second distal end of the first connecting member and the second surface of the second structure, wherein the second connecting member electrically interconnects the second distal end to the second surface and forms a bond therebetween along a second axis, wherein the second axis is not parallel to the first axis.
Dependencies are inferred from the claim text.