Communication module having a structure for reducing crosstalk

A communication module, comprising:

• a semiconductor chip in which channels for allowing signal converting means to convert current signals inputted from input terminals to voltage signals and outputting the same from output terminals respectively are arranged in parallel in plural form;
• said semiconductor chip being comprised principally of a semiconductor substrate in which a second semiconductor layer is provided on a first semiconductor layer with a first insulating layer interposed therebetween;
• said signal converting means being formed in a channel forming region of the second semiconductor layer, which is defined for each channel;
• said input and output terminals being formed on the channel forming regions of the second semiconductor layer with a second insulating layer interposed therebetween;
• and
• wherein a first conductor fixed to a first fixed potential is provided between the input terminals and the second semiconductor layer.

A communication module, comprising:

• a semiconductor chip in which channels for allowing signal converting means to convert current signals inputted from input terminals to voltage signals and outputting the same from output terminals respectively are arranged in parallel in plural form;
• said semiconductor chip being comprised principally of a semiconductor substrate in which a second semiconductor layer is provided on a first semiconductor layer with a first insulating layer interposed therebetween;
• said signal converting means being formed in a channel forming region of the second semiconductor layer, which is defined for each channel;
• said input and output terminals being formed on the channel forming regions of the second semiconductor layer with a second insulating layer interposed therebetween;
• and
• wherein a conductor electrically separated from said each channel forming region and fixed to a fixed potential is provided between the channel forming regions of the second semiconductor layer.

A communication module, comprising:

• a semiconductor chip in which channels for allowing a plurality of signal converting means to convert current signals inputted from input terminals to voltage signals and outputting the same from output terminals respectively are arranged in parallel in plurality form;
• said semiconductor chip being comprised principally of a semiconductor substrate in which a second semiconductor layer is provided on a first semiconductor layer with a first insulating layer interposed therebetween;
• said signal converting means being formed in a channel forming region of the second semiconductor layer, which is defined for each channel;
• said input and output terminals being formed on the channel forming regions of the second semiconductor layer with a second insulating layer interposed therebetween;
• and
• resistive elements being formed over said second semiconductor layer;
• wherein first portions of said first semiconductor layer under said resistive elements have a resistivity smaller than that of said second semiconductor layer.