Inspection analyzing apparatus and semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKyoko Asahina, Yoko Miyazaki, Kaoru Yamana
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Abstract
A monitor wafer is processed by a processing apparatus, and thereafter, it is subjected to an inspection in a foreign object inspection apparatus in accordance with an inspection recipe. A measured result obtained by the inspection is compiled and analyzed in a data management system. Generally, a monitor wafer is not assigned a rot name or a wafer name, however, the measured result is assigned an identification name for identifying plural processing apparatuses from one another, and is stored in a database as storage data.
Claims16
An inspection analyzing method comprising the steps of:
- (a) providing one or more monitor wafers for each of a plurality of processing steps individually performed by a plurality of processing apparatuses, at least one of said plurality of processing steps being performed by one of a first processing apparatus and a second processing apparatus of said plurality of processing apparatuses to perform a substantially same processing function;
- (b) performing an inspection on said one or more monitor wafers to obtain an inspection result;
- and
- (c) assigning said inspection result an identification name for identifying each of said plurality of processing apparatuses having performed said plurality of said processing steps in said step (a) on said one or more monitor wafers subjected to said inspection by which said inspection result is obtained, and storing said inspection result.
An inspection analyzing method, comprising the steps of:
- (a) performing a plurality of inspections on a wafer processed in a first processing step and a second processing step which is executed after said first processing step, said first and second steps being performed by a plurality of processing apparatuses, the first processing step is executed by one of a first processing apparatus and a second processing apparatus configured to perform a substantially same function;
- (b) assigning an inspection result and an identification name that identifies a respective one of said first or second processing apparatus having performed said first processing step on said wafer;
- and
- (c) comparing a plurality of inspection results obtained by said first processing step with an inspection result obtained by said second processing step for resolving a predetermined wafer condition to either the first or second processing apparatus.
Dependencies are inferred from the claim text.