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US 6,551,755 B2Granted
Positive photoresist composition
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsShinichi Hidesaka, Atsushi Sawano
Life of this patent
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Abstract
A positive photoresist composition includes (A) an alkali-soluble resin and (B) a photosensitive ingredient, in which the photosensitive ingredient (B) includes an ester of a compound represented by following Formula (I) with a 1,2-naphthoquinonediazidosulfonyl compound: This positive photoresist composition can form a resist pattern mixture including both a dense pattern and an isolation pattern with good shapes and can especially minimize the formation of a back taper shape of an isolation pattern induced by shift of the focus to the minus side.
Claims5
A positive photoresist composition comprising:
- (A) an alkali-soluble resin;
- and
- (B) a photosensitive ingredient, said photosensitive ingredient (B) comprising an ester of a compound represented by following Formula (I) with a 1,2-naphthoquinonediazidosulfonyl compound:
Dependencies are inferred from the claim text.