Liquid developing method of printed wiring board

A liquid developing method for a printed wiring board which comprises the steps of

• providing a material to be developed comprising an insulating substrate having two sides, which are copper-clad on both sides, and photoconductive layers coated on both copper-clad sides;
• forming a toner image on one side of the two sides;
• overturning the material having a toner-imaged side and non-toner imaged side;
• statically charging and exposing the non-toner imaged side to form an electrostatic latent image;
• electrostatically charging the toner-imaged side before developing the electrostatic latent image side;
• and
• developing the latent image side to form a resist pattern.

A liquid developing method for preparing a printed wiring board comprising the steps of

• providing a material comprising an insulating substrate having two sides, which are copper-clad on both sides, and photoconductive layers coated on both copper-clad sides;
• forming an electrostatic latent image on one side of the two sides;
• statically charging the other side that does not have an electrostatic latent image before developing the electrostatic latent image side;
• and
• reversal developing the electrostatic latent image side with a liquid toner;
• and
• removing an excessive amount of the toner in the step of reversal developing the electrostatic latent image side with a liquid toner by combination of a liquid-absorption roll having a capillary function at the side that does not have an electrostatic latent image and a roll made of an elastic material having no liquid-absorbing property at the side having an electrostatic latent image.