Semiconductor device having signal contacts and high current power contacts

A circuit assembly, comprising:

• a printed circuit board;
• a semiconductor device, comprising:
• a casing;
• a semiconductor die supported by the casing;
• at least one exposed contact pad disposed on a bottom surface of one of the casing and the semiconductor die;
• and
• a plurality of external contacts extending from the casing and being coupled to the semiconductor die, the contact pad having a higher current-carrying capacity than each of the external contacts;
• and
• a socket coupled to the printed circuit board and adapted to receive the semiconductor device, the socket comprising:
• a first plurality of contacts adapted to interface with the external contacts of the semiconductor device;
• at least one base contact adapted to interface with the contact pad;
• a base portion haveing a first plurality of openings, wherein the first plurality of contacts are coupled to the printed circuit board and disposed within the first plurality of openings;
• and
• a top portion slidingly attached to the base portion, the top portion including a second plurality of openings corresponding to the first plurality of openings in the base portion.

A circuit assembly, comprising:

• a printed circuit board,
• a semiconductor device, comprising:
• a casing;
• a semiconductor die supported by the casing, the casing having an opening exposing at least a portion of the semiconductor die;
• at least one exposed contact pad disposed on the exposed portion of the semiconductor die;
• and
• a plurality of external contacts extending from the casing and being coupled to the semiconductor die the contact pad having a higher current-carrying capacity than each of the external contacts;
• and
• a socket coupled to the printed circuit board and adapted to receive the semiconductor device, the socket comprising:
• a first plurality of contacts adapted to interface with the external contacts of the semiconductor device;
• and
• at least one base contact adapted to interface with the contact pad.