Heatsink device

Abstract

A heatsink device includes a plurality of heatsink plates (1, 4, 5, 6) each made of heat conductive material. Each of the heatsink plates (1, 4, 5, 6) is formed with at least one through hole (11, 41, 51, 61). A periphery of the through hole (11, 41, 51, 61) is formed by an annular wall (12, 52) or sidewalls 62 which defining a opening(13, 53, 63). A heat conductive post (2, 7) formed as a rod and made of heat conductive material, the heat conductive post (2, 7) is forced to fittingly insert into the through hole (11, 41, 51, 61), so that the heat conductive post (2, 7) may be combined with the heatsink plates (1, 4, 5, 6) more rigidly and stably.

Dependencies are inferred from the claim text.