Double-sided wafer edge scrubbing apparatus and method for using the same

A substrate cleaning system, comprising:

• a cleaning station, the cleaning station including,
• a first brush;
• a second brush, the second brush being oriented relative to the first brush so as to receive a flat circular substrate therebetween, the first brush and the second brush being configured to simultaneously scrub a first and second surface of the flat circular substrate;
• a scrubbing clamp, the scrubbing clamp being configured to receive an edge of the flat circular substrate, the scrubbing clamp having a scrubbing pad for scrubbing a first surface edge of the first surface, a second surface edge of the second surface, and an edge that is not part of either the first or second surface, wherein the scrubbing clamp has a clamp top and a clamp bottom, the clamp top and the clamp bottom being adjustable so as to apply a force on the first surface and the second surface of the flat circular substrate.

A scrubbing roller for scrubbing peripheral regions of a semiconductor wafer, comprising:

• a top roller core;
• a bottom roller core, the top roller core and the bottom roller core defining a U-shaped circular pocket;
• and
• a scrubbing pad configured to line the U-shaped circular pocket, the scrubbing pad being configured to receive an edge region of a semiconductor wafer, the edge region configured to be inserted into the U-shaped circular pocket so as to scrub a top surface region, an edge surface region and a bottom surface region of the edge region of the semiconductor wafer, wherein the top roller core and the bottom roller core are adjustable so as to change an opening of the U-shaped circular pocket and apply a force.