Back to results
US 6,549,822 B1Granted
Method and apparatus for control of multi-cup semiconductor manufacturing tracks
AssigneeAdvanced Micro Devices, Inc.
InventorAnthony J. Toprac
Life of this patent
Estimating the term…
Abstract
The present invention provides for a method and an apparatus for controlling multiple semiconductor wafer cups. At least one process run of semiconductor devices is processed. A multi-wafer-cup process analysis is performed upon the processed semiconductor devices. At least one control parameter is modified for a subsequent process run of semiconductor devices using results from the multi-wafer-cup process analysis.
Claims28
A method, comprising:
- performing at least one process run of semiconductor devices;
- performing a multi-wafer-cup process analysis upon the processed semiconductor devices, said multi-wafer-cup process analysis comprising correlating identification data relating to said semiconductor devices from a plurality of cups, with metrology data relating to semiconductor devices from said plurality of cups;
- and
- modifying at least one control parameter for a subsequent process run of semiconductor devices using results from said multi-wafer-cup process analysis.
1 more element
An apparatus, comprising:
- a computer system;
- a manufacturing model coupled with said computer system, said manufacturing model being capable of generating at least one control parameter input signal;
- a machine interface coupled with said manufacturing model, said machine interface being capable of receiving process recipes from said manufacturing model;
- a first processing tool capable of processing semiconductor wafers and coupled with said machine interface, said first processing tool being capable of receiving at least one control input parameter signal from said machine interface;
- a first wafer cup coupled with said first processing tool for receiving semiconductor wafers, wherein said first wafer cup is capable of applying a photoresist material onto a semiconductor wafer;
- a second processing tool capable of processing semiconductor wafers and coupled with said machine interface, said second processing tool being capable of receiving at least one control input parameter signal from said machine interface;
- a second wafer cup coupled with said second processing tool for receiving semiconductor wafers, wherein said second wafer cup is capable of applying a photoresist material onto a semiconductor wafer;
- a metrology tool coupled with said first processing tool and said second processing tool, said metrology tool being capable of acquiring metrology data;
- a metrology data processing unit coupled with said metrology tool and said computer system, said metrology data processing unit being capable of organizing said acquired metrology data and sending said organized metrology data to said computer system;
- and
- a controller operatively coupled with said computer system, said controller to perform a multi-wafer-cup process analysis, said multi-wafer-cup process analysis comprising correlating identification data relating to said semiconductor devices from said first and second cups with metrology data relating to semiconductor devices from said first and second cups.
8 more elements
An apparatus, comprising:
- means for performing at least one process run of semiconductor devices;
- means for performing a multi-wafer-cup process analysis upon the processed semiconductor devices, said means for performing said multi-wafer-cup process analysis further comprising correlating identification data relating to said semiconductor devices from a plurality of cups, with metrology data relating to semiconductor devices from said plurality of cup;
- and
- means for modifying at least one control parameter for a subsequent process run of semiconductor devices using results from said multi-wafer-cup process analysis.
1 more element
A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising:
- performing at least one process run of semiconductor devices;
- performing a multi-wafer-cup process analysis upon the processed semiconductor devices, said multi-wafer-cup process analysis comprising correlating identification data relating to said semiconductor devices from a plurality of cups, with metrology data relating to semiconductor devices from said plurality of cups;
- and
- modifying at least one control parameter for a subsequent process run of semiconductor devices using results from said multi-wafer-cup process analysis.
1 more element
An apparatus, comprising:
- a controller adapted to perform a multi-wafer-cup process, said multi-wafer-cup process comprising correlating identification data relating to a wafer from a plurality of cups, with metrology data relating to wafers from said plurality of cups.
Dependencies are inferred from the claim text.