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US 6,549,426 B1Granted
Electronic enclosure with improved EMC performance
AssigneeDelphi Tecnologies, Inc.
InventorsDaniel A. Lawlyes, Roy A. Visser
Life of this patent
Estimating the term…
Abstract
An electronics assembly 10 is provided, including a base element 16 and a cover element 18. The base element 16 includes a perimeter mating groove 20 and the cover element 18 including a perimeter tongue element 26. A plurality of crush ribs 34 are formed into the perimeter tongue element 26 such that when the perimeter tongue element 26 is positioned within the perimeter mating groove 20 during assembly, the plurality of crush ribs 34 establish conductive contact between the base element 16 and the cover element 18.
Claims18
An electronics assembly comprising:
- an electronic enclosure, including a base element and a cover element;
- a perimeter mating groove defined by an inner groove wall and an outer groove wall, said perimeter mating groove formed in said base element;
- a perimeter tongue element formed on said cover element, said perimeter tongue element positioned within said perimeter mating groove upon assembly of said electronics enclosure;
- and
- plurality of crush ribs formed into said perimeter tongue element, said plurality of crush ribs providing conductive contact between said base element and said cover element such that a contiguous protective shield is formed around an electronics component positioned within said electronics enclosure.
2 more elements
An electronics enclosure comprising:
- an electronics enclosure including a base element and a cover element;
- a perimeter mating groove defined by an inner groove wall and an outer grove wall;
- a perimeter tongue element positioned within said perimeter mating groove upon assembly of said electronics enclosure;
- a plurality of crush ribs formed into said perimeter tongue element, said plurality of crush ribs providing conductive contact between said base element and said cover element such that the EMC performance of an electronic component positioned within said electronics enclosure is improved.
1 more element
Dependencies are inferred from the claim text.