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US 6,549,414 B1Granted
Computers
AssigneeCybernetics Technology Co., Ltd.
InventorsTsunemi Tokuhara, Masaaki Takizawa, Mikio Fukushima
Life of this patent
Estimating the term…
Abstract
A low cost computer is suitable for small size configuration. Casings 4 and 32 are formed by aluminum, which is a heat radiating material, and CPUs 6 and 36, hard disk devices 8 and 38, control ICs 40 and 42 and a memory IC are mounted on the casing 4 directly or by the heat radiating material. The casings 4 and 32 are utilized as heat radiators, thereby making the entire computer a smaller size.
Claims5
A computer comprising:
- a casing made of heat radiating aluminum sheet, said casing including a bottom cover made of an aluminum radiation plate and a rear panel made of an aluminum radiation plate having fins;
- an aluminum angle fixed to said rear panel inside said casing;
- a CPU device mounted on an inner wall surface of said bottom cover made of an aluminum radiation plate such that heat generated by said CPU is absorbed by said bottom cover of said casing;
- and
- a hard disk device mounted on said aluminum angle fixed to said rear panel such that heat generated by said hard disk device is absorbed by said rear panel of said casing.
2 more elements
A computer comprising:
- a casing made of heat radiating aluminum sheet, said casing including a front panel made of an aluminum radiation plate, a rear panel made of an aluminum radiation plate having integrally formed fins and an insertion groove, a top cover made of an aluminum radiation plate and a bottom cover made of an aluminum radiation plate;
- a circuit substrate fixed with respect to said casing;
- a CPU, a control IC and a memory IC disposed on said circuit substrate;
- a support sheet of aluminum which adheres tightly to said casing;
- a hard disk device fixed to said support sheet;
- at least one aluminum heat sink sheet fixed to said casing, wherein at least one of said control IC and said memory IC adheres tightly to said at least one aluminum heat sink sheet;
- an aluminum heat sink block, wherein said CPU adheres tightly to said aluminum heat sink block;
- and
- a heat pipe made of a heat radiating metallic material which has a first portion adhering tightly to said heat sink block and a second portion fitted in said insertion groove of said rear panel so that heat from said CPU can be absorbed by said rear panel and dispersed by said fins of said rear panel.
6 more elements
Dependencies are inferred from the claim text.