Heatsink mounting system

Abstract

The invention relates to a mounting arrangement for a heatsink for cooling a microelectronic device contained within a chassis. The mounting arrangement includes a heatsink, a motherboard incorporating the microelectronic device thereon and securing means adapted to position both the heatsink and the motherboard in a mounting configuration so that the motherboard is held in fixed relation to the chassis and the heatsink is biased in thermal contact with the microelectronic device by means of a biasing means adapted to engage with both the securing means and the heatsink, whereby the weight of the heatsink thereby is substantially supported by the chassis by way of the securing means. The securing devices in a preferred embodiment correspond to pins which pass through the heatsink, through the motherboard, while simultaneously anchoring same to the chassis, and are attached to the chassis. A biasing device is interposed between each pin and the heatsink, so that as the pins are secured, the heatsink is pressed gently against the device. Suitable applications include PCs, servers and other computer architectures.

Dependencies are inferred from the claim text.