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US 6,549,408 B2Granted
CPU cooling device using thermo-siphon
AssigneeGlobal Cooling, Inc.
InventorDavid M. Berchowitz
Life of this patent
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Abstract
A hollow evaporator is disposed in contact with the upper surface of the CPU. Heat from the CPU is absorbed by the evaporation of the refrigerant. The vaporized refrigerant ascends through the vapor flow channel by convection, flows into a condenser located above the evaporator, and radiates heat to be liquefied. The liquefied refrigerant flows down by its own weight through the liquid flow channel and returns to the evaporator. This circulation is repeated in this manner.
Claims2
A device for cooling a CPU, the device comprising:
- (a) a thermo-siphon comprising
- (i) an evaporator disposed in contact with the CPU, the evaporator being a hollow vessel having a refrigerant inlet port and refrigerant outlet port;
- (ii) a condenser comprising a flow channel located above the evaporator, the condenser having a vaporized refrigerant inflow portion located at an upper portion thereof and a liquefied refrigerant outflow portion located at a lower portion thereof;
- (iii) a vapor flow channel connecting the evaporator refrigerant outlet port to the condenser refrigerant inflow portion;
- and
- (iv) a liquid flow channel connecting said inlet port of the refrigerant and said outflow portion of the liquefied refrigerant;
- (b) a Stirling refrigerator having a heat sink portion disposed in contact with the condenser flow channel;
- (c) a predetermined amount of pressurized, CO2, refrigerant sealed within and filling the interconnected condenser, liquid flow channel, evaporator and vapor flow channel for absorbing heat from the CPU in the evaporator to be evaporated, ascending through the vapor flow channel, entering into the condenser, radiating heat in the condenser to be liquefied, flowing down through the liquid flow channel, and returning to the evaporator.
5 more elements
Dependencies are inferred from the claim text.