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US 6,549,392 B1Granted
Method for reducing particles from an electrostatic chuck and an equipment for manufacturing a semiconductor
AssigneeNGK Insulators, Ltd.
InventorsMasashi Ohno, Mie Nagao, Hiromichi Kobayashi
Life of this patent
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Abstract
A method for reducing particles from an electrostatic chuck, wherein the difference between a wafer temperature before absorbing and a wafer maximum temperature after absorbing is 50° C. or below when the wafer is absorbed onto the electrostatic chuck.
Claims4
A method for minimizing the presence of particles on an electrostatic chuck, wherein a wafer to be held on such chuck is pre-heated so that the difference between wafer temperature before holding and wafer maximum temperature after holding is 50° C. or below when such a wafer is held by an electrostatic chuck.
Dependencies are inferred from the claim text.