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US 6,548,907 B1Granted
Semiconductor device having a matrix array of contacts and a fabrication process thereof
AssigneeFujitsu Limited
InventorsNaoto Yamada, Norihiro Kobayashi
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip carrying a plurality of contact electrodes on a principal surface thereof, wherein the contact electrodes are arranged symmetrically about an axis of symmetry according to the types of the contact electrodes.
Claims17
A semiconductor device, comprising:
- a semiconductor chip;
- and
- a plurality of contact electrodes provided on a surface of said semiconductor chip, said plurality of contact electrodes carrying signals of respective types,
- wherein said surface of said semiconductor chip is divided into a plurality of regions such that each of said contact electrodes, included in one of said plurality of regions, is disposed symmetrically with respect to corresponding contact electrodes included in said other regions about a hypothetical center of axial symmetry located on said surface of said semiconductor chip,
- wherein said corresponding contact electrodes carry a signal of the same type, and
- wherein said plurality of regions can be tested with a common testing board by rotating said semiconductor chip or said common testing board.
3 more elements
A semiconductor device, comprising:
- a semiconductor chip;
- and
- a plurality of contact electrodes provided on a surface of said semiconductor chip, said plurality of contact electrodes carrying signals of respective types,
- wherein, said plurality of contact electrodes are disposed on said surface of said semiconductor ship such that a first contact electrode included in said plurality of contact electrodes and carrying a signal of a first type is disposed symmetrically with respect to a second contact electrode included in said plurality of electrodes and carrying a signal of said first type about a hypothetical center of axial symmetry located on said surface of said semiconductor chip, and
- wherein said plurality of electrodes can be tested with a common testing board by rotating said semiconductor chip or said common testing board.
2 more elements
Dependencies are inferred from the claim text.