Electrostatic discharge protection apparatus with silicon control rectifier and the method of fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsChiu-Tsung Huang, Wen-Kuan Yeh, Lu-Min Liu
Life of this patent
Estimating the term…
Loading patent…
AssigneeUnited Microelectronics Corp.
InventorsChiu-Tsung Huang, Wen-Kuan Yeh, Lu-Min Liu
Estimating the term…
An electrostatic discharge protection apparatus with silicon control rectifier and the method of fabricating the apparatus. Using silicon on insulator technique, a bottom layer, a P-well, a first source/drain region, a second source/drain region and a gate are formed. A selective epitaxial growth region is selectively formed on the first source/drain region, and an N+ region is formed on the bottom layer. The lower portion of the N+ region is then adjacent to the P-well, and the upper portion of the N+ region is adjacent to the gate. Thus, a PNPN silicon control rectifier is formed, and the silicon on insulation CMOS technique is effectively transplanted into the electrostatic discharge apparatus.
A method of fabricating an electrostatic discharge protection providing a substrate layer;
A method of fabricating an electrostatic discharge protection apparatus with a silicon control rectifier, the method comprising:
Dependencies are inferred from the claim text.